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Description

Memory corruption while creating a process on the digital signal processor due to allocation failure at the kernel level.

PUBLISHED Reserved 2025-05-06 | Published 2026-05-04 | Updated 2026-05-05 | Assigner qualcomm




HIGH: 7.8CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Problem types

CWE-367 Time-of-check Time-of-use (TOCTOU) Race Condition

Product status

Default status
unaffected

CQ7790
affected

CQ8725S
affected

FastConnect 6200
affected

FastConnect 6700
affected

FastConnect 6900
affected

FastConnect 7800
affected

G2 Gen 1
affected

Molokai
affected

Netrani
affected

Orne
affected

Palawan25
affected

Pandeiro
affected

QCA6391
affected

QCM2290
affected

QCM4325
affected

QCS2290
affected

QCS4290
affected

QLN1083BD
affected

QLN1086BD
affected

QMB715
affected

QMP1000
affected

QMP2001
affected

QPA1083BD
affected

QPA1086BD
affected

Qualcomm Video Collaboration VC1 Platform
affected

Qualcomm Video Collaboration VC3 Platform
affected

QXM1083
affected

QXM1086
affected

QXM1093
affected

QXM1094
affected

QXM1095
affected

QXM1096
affected

SAR1165P
affected

SAR2130P
affected

SC8380XP
affected

SD662
affected

SD865 5G
affected

SM6225P
affected

SM6450P
affected

SM6475P
affected

SM6475Q
affected

SM6850
affected

SM7435
affected

SM7435P
affected

SM7635P
affected

SM8735P
affected

SM8750P
affected

SM8845P
affected

Snapdragon 4 Gen 2 Mobile Platform
affected

Snapdragon 460 Mobile Platform
affected

Snapdragon 6 Gen 1 Mobile Platform
affected

Snapdragon 6 Gen 3 Mobile Platform
affected

Snapdragon 662 Mobile Platform
affected

Snapdragon 680 4G Mobile Platform
affected

Snapdragon 685 4G Mobile Platform
affected

Snapdragon 7 Gen 4 Mobile Platform
affected

Snapdragon 8 Elite
affected

Snapdragon 8 Elite Gen 5
affected

Snapdragon AR1+ Gen 1 Platform
affected

Snapdragon W5+ Gen 1 Wearable Platform
affected

Snapdragon XR2 5G Platform
affected

Snapdragon XR2+ Gen 1 Platform
affected

Snapdragon Wear Elite platform
affected

SW5100
affected

SW5100P
affected

SXR2230P
affected

SXR2250P
affected

SXR2330P
affected

SXR2350P
affected

Themisto
affected

WCD9370
affected

WCD9375
affected

WCD9378
affected

WCD9380
affected

WCD9385
affected

WCD9395
affected

WCN3950
affected

WCN3980
affected

WCN3988
affected

WCN6450
affected

WCN6755
affected

WCN7760
affected

WCN7860
affected

WCN7861
affected

WCN7880
affected

WCN7881
affected

WSA8810
affected

WSA8815
affected

WSA8830
affected

WSA8832
affected

WSA8835
affected

WSA8840
affected

WSA8845
affected

WSA8845H
affected

WSA8850
affected

WSA8850W
affected

WSA8855C
affected

X1E80100
affected

XRV7209
affected

XRV9209
affected

References

docs.qualcomm.com/...securitybulletin/may-2026-bulletin.html

cve.org (CVE-2025-47407)

nvd.nist.gov (CVE-2025-47407)

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